Condensation and Growth of Kirkendall Voids in Intermetallic Compounds

EFFECTS OF THERMAL AGING ON INTERMETALLIC COMPOUNDS AND VOIDS FORMATION IN AuAl WIRE BONDING

There are several issues related to the mechanical and electrical wirebond failure during wirebonding process. Major factors are associated with AuAl intermetallic system. AuAl intermetallic compounds (IMC) can easily form at room temperature and can be accelerated with the elevated temperature. In this paper, pattern of intermetallic compounds growth and potential degradation due to voids in t...

synthesis of 3-aryl-2h-benzo[b]-1,4-oxazines in [omim]bf4 and reduction of organic compounds in methylimidazolium formate

در این پروژه ترکیبات 3-آریل-2h-بنزو[b]-4،1-اکسازین ها از مواد اولیه تجاری مشتقات دو آمینو فنول و ?-هالو کتون های آروماتیک در مایع یونی 1-اکتیل-3-متیل ایمیدازولیوم تترا فلورو بورات([omim]bf4) سنتز شده است. این واکنش توسط باز پتاسیم کربنات محلول از طریق o-آلکیلاسیون و سپس یک واکنش آمیداسیون درون مولکولی خود بخود در مدت زمان کوتاه انجام می شود. ترکیبات 4،1-بنزوکسازین به این روش با بهره خوب تا آلی ...

Crystal Growth and Stoichiometry of Strongly Correlated Intermetallic Cerium Compounds

On the effect of KIRKENDALL voids on solder joint reliability

A model for the theoretical description of KIRKENDALL voiding is presented based on vacancy diffusion and plastic deformation of spherical voids. We start with a phenomenological explanation of the KIRKENDALL phenomenon and discuss its consequences on microelectronic reliability. After that a constitutive model for void growth is introduced, which, for instances, can be used in order to predict...

Differential thermal analysis and solution growth of intermetallic compounds

To obtain single crystals by solution growth, an exposed primary solidification surface in the appropriate, but often unknown, equilibrium alloy phase diagram is required. Furthermore, an appropriate crucible material is needed, necessary to hold the molten alloy during growth, without being attacked by it. Recently, we have used the comparison of realistic simulations with experimental differe...